Nearly two months ago, the first Ryzen 7 9850X3D processor was leaked as part of AMD’s upcoming X3D refresh for the Zen 5 lineup, which was later officially announced in a website post indicating that the launch was just around the corner.
The same tipster has now returned with a leaked packing slip that lists the core specs of the processor, confirming that it has a TDP of 120W.
The manifest shows an internal date of October 18, 2025, which perfectly matches the original leaks that first revealed the 9850X3D to us. The part number is “100-000001973-00” with the name “120W” in front of it. We don’t know pricing or availability yet, but now that we know AMD processor prices aren’t subject to an boost, they should be around $450.
TSMC’s advanced packaging technology allowed AMD to place an additional 3D V-Cache directly under the CCD in the Ryzen 9000, leading to lower latency, better clocks, and less cooling required to keep everything in control. Add some elementary sorting and software optimization to that list and you’ve got a 9850X3D that should offer a bit more FPS in games everywhere.
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