A group of European countries under the leadership of the Netherlands establish a basis for the European Act on chips 2.0 after the original one has not achieved the purpose of strengthening the European semiconductor industry, informs Reuters. The group aims to provide specific proposals to summer closely cooperating with the European Commission. Politicians indicated their work after the manufacturers of tokens and sailing tools asked EC to start continuing 2023 Act on systems.
The group includes nine members of the European Union under the leadership of the Netherlands, including France, Germany, Italy and Spain, which already have semiconductor industries (except for Spain, which is more focused on research and development). The Dutch Minister of Economy Dirk Beljaarts explained that this group is preparing for the potential second financing package for the semiconductor industry, including both petite and medium -sized companies.
“We have to allocate funds,” said Reuters Beljaarts. “Both private and public funds to push the sector, also in order to make sure that the rafting effect takes place, as well as (small and medium -sized) companies.”
The program of the Act on Chips 2023, which is currently under review, did not achieve any significant purposes, because it required that in requiring the approval of projects financed by member and EC (however, most projects were financed only by member states). The approval processes required by EC, member states and local authorities were too snail-paced for the rapidly developing semiconductor industry. As a result, Intel and Wolppeed translated the main production facilities in Europe, because economic situations changed in anticipation of their approval. According to Beljaarts, this time is the intention to be more selective and strategic in financing decisions.
Europe is mighty in areas such as research and development, as well as tools for creating chips (ASML, ASM International, Carl Zeiss SMT, Suss Microtec, etc.). However, only Intel creates systems using advanced process technology in Ireland. Other European chip manufacturers utilize end nodes.
Due to the interest in selling the most advanced tools and government financing, the creators of semiconductor production devices called EC to start the second round of financing.
After meeting in Brussels with European legislators, ESIA and Semi Europe (United Organizations for chip and equipment manufacturers) stated that formally considering their proposal to Henna Virkkunen, a digital EC official. Semi was found a need for direct support in several areas outside the FAB, including “design and production of semiconductors, research and development, materials and equipment.”
A dozen or so companies joined the meeting. Among them were producers of Bosch, Infineon, NXP and Stmicroelectronics chip, as well as ASML, ASM, Zeiss and Air Liquide equipment suppliers.
