Samsung has begun mass production of the world’s thinnest 12GB and 16GB LPDDR5X DRAM memory packages. These novel products are about 0.65mm broad, 0.06mm thinner than typical LPDDR5X packages.
Samsung has used a novel packaging technique, including an optimized printed circuit board (PCB) and epoxy molding compound (EMC), to build the novel 4-layer structured packages. An optimized back-lapping process has been used to further reduce the package height. This design improvement facilitates better airflow inside the smartphones, greatly improving thermal management, which is a key aspect for devices with powerful application processors, including those with advanced on-device AI capabilities.
Samsung said the novel 0.65mm LPDDR5X modules are 9% thinner than typical LPDDR5X modules and feature 21.2% improved thermal resistance compared to previous-generation LPDDR5X devices.
“Samsung’s LPDDR5X DRAM sets a new standard for high-performance AI on-device solutions, offering not only improved LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, vice president of memory product planning at Samsung Electronics. “We are committed to continuous innovation by working closely with our customers to deliver solutions that meet the future needs of the low-power DRAM market.”
It is tough to say how much thinner smartphones can become due to the operate of 0.65 mm cases compared to 0.71 mm cases. Typically, mobile phone manufacturers operate various techniques to improve their devices, including making them thinner. To this end, it is to be expected that smartphone manufacturers will want to make their products thinner, as well as operate thinner protective glass, thinner circuit boards and, most importantly, thinner batteries.
The thinner LPDDR5X DRAM packages will contribute to slimmer smartphones, although they won’t be decisive. The thinner DRAM packages will likely improve airflow inside the devices, positively affecting their performance.
Looking ahead, Samsung plans to expand its LPDDR5X offerings. The company is looking to develop 6-layer 24GB and 8-layer 36GB modules in compact packages, although Samsung is refraining from revealing the actual thickness of these upcoming memory modules.
