Digitimes Reported Today Yangtze Memory Technologies Corp. (YMTC) prepares the entrance to the production of dram and exploring the partnership with Changxin Memory Technologies (CXMT) to direct high bandwidth memory (HBM), Premium drama arranged next to many of the highest quality AI AI.
This movement would adapt the leading NAND manufacturer in China with a leading DRAM supplier at a time when HBM is the hottest element in the data center, and the Chinese government willingly reduces relying on the giants of great memory Samsung, SK Hynix and Micron.
Two memory giants, one goal
HBM has become an engine growth engine, driven by GPU and non -standard AI silicon. Washington noticed. Industry and Security Office in December 2024 Creating recipes It is clearly adding HBM control with modern restrictions on equipment for creating a squirrel, ultimately sharpening China’s access to technology that powers AI. It is the background of politics that helps explain why we can see the cooperation of YMTC-CXMT.
On the ground, CXMT raises the curve. Reporting until 2024 and until this year indicates that the company produced HBM2 and is Striving for HBM3 in an accelerated schedule. Many Chinese sales and researchers describe the HBM3 2026-2027 and HBM3E production window. It, according to analystsHe puts a company on a trajectory, which puts CXMT for a few years behind Korean leaders, but for a much faster term.
Where the ymtc is fitting
The value of YMTC in this potential partnership does not apply to drama pedigree, as knowledge about binding. The company’s “Xtacking” architecture, the Wafania tile process Techinsights Described as a leading implementation of hybrid bond, it has been used for years for mass NAND producing. This specialist knowledge is very crucial at a time when a wider HBM industry constantly migrates towards a hybrid binding to enhance capacity and improve thermal efficiency as the pile is increased.
The packaging chain is also built in the country. Reuters In 2024, they reported that Chinese companies, including CXMT and Wuhan Xinxin, developed HBM packaging methods with tongf microelectronics removal for assembly. Because the advanced packaging becomes a practical gate on the delivery of HBM, semiconductor outsourcing and testing such is practically inevitable if Fab want to scale the output.
Ultimately, such situations do not arise in a vacuum. The United States continues to tighten the control around Chinese toys. Today’s news TSMC nanjing plant lose the status of quick tracking The most crucial information is once again how export licensing is becoming more detailed and time consuming, because the US is trying to hinder the advanced production of semiconductors in China.
Even if the future YMTC-CXMT partnership ensures, the availability of tools and customer qualifications will determine whether Chinese HBM can scale outside the domestic market.
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