For many years, CPU and GPU simply dealt with the apply of power. Nowadays this is a completely different story, and Bum Ai has forced processor designs to consume huge power. To assist put in all this heat, some companies create such elaborate thermal solutions that they could easily convey works of art.
One such example is Liquid cool aluminum plate for nvidia h100 ai superchip (via Semiconductor), but what makes it stand out from the crowd How This is done. Most of the cool plates, i.e. water blocks, are milled with several bite of metal, which are screwed together to create a chamber. Degrees of enterprises established forces from nop Using the latter modeling software to do something so complicated that grinding or casting would be impossible.
After modeling the perfect liquid flow through NTOP software, and then created the 3D model of everything. Since it cannot be produced as the whole unit, the software package cuts it out, with each layer cut from an aluminum sheet. These layers are then treated before arranging.
Then magic Binding diffusion It takes place when a reasonable amount of heat and pressure is used in the long run, which basically forces skinny layers to bind in such a way that for all purposes and purposes it becomes one block of metal.
The top -fingers of enterprises summarize appropriate marketing engineering: “180 micronic microcapillary, which direct coolant with precision to areas with high thermal power, parallel inlet and output channels, which minimize the length of flow and pressure drop and the structure of gyroscopic filling, which increases the surface, while confirming internal volume.”
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The H100 NVIDIA is a 700 W GPU, where G means “AI training, large -scale inference and processing of data”, not graphics. Of course, this is a lot of power, although RTX 5090 RTX 5090 RTX is not too far behind at 575 W. Because things are currently standing, GPUs are the real powers of the processor world, but it will not take much time before the CPU is equally or in advance.
This is according to another King the size of a cooler company, Microops, which gave a presentation (via X-User HXL) about how it was to solve 4000 energy consumption in future generations of server processors. And we don’t talk about 50 years in the future or anything; Microops predicts such power levels up to 2034.
AMD EPYC 9965The 192-core Zen 5C processor can apply up to 500 W Power, but Techpowerup It reports that the company will aim at a double number of this number for the next generation of mass -huge processors. Air cooling is simply not good enough for such things, so the Books of Orders Mikroloops, aluminum enterprises and many others will probably be full thanks to AI designers who want to maximize the performance of water -cooled thermal solutions.
However, I would not be surprised if we started seeing similar projects starting to the gaming computers. I do not mean OEM compilation; It will be ultra-enthusiasts and overclockers, who willingly bioses model their RTX 5090s apply 750 W or higher. But in the end, what is successful at the niche end of things often finds a way to flow to the general consumer.
The chambers of pairs, water cooling, and even RGB lighting were once a rain of few, but now everyone can spend some cash and throw them into their modest glass boxes. So who knows, by 2034. We could all have a cool diffusion tied plate on our processors and we will continue here, they argue about who creates the best structures of filling the gyroscope.
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