Apple apparently begins the production of M5 chips using a 3NM node with reinforced TSMC performance

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Apple has started the production of its fresh generation M5 M5 processor on a huge scale for desktop computers, laptops and high -performance tablets, reports Etnews citing your own sources. It is expected that the fresh system-on-chip (SOC) will apply the N3P production process enhanced by the performance, which was to enter mass production in the second half of 2024, so the information has some advantages. Still, because the information comes from an unofficial source, it should be taken with salt grain.

M5 Apple is a fresh generation processor for Mac at the basic level, as well as high -class iPad Pro tablets. It is forecasted that the M5 family includes M5, M5 Pro, M5 Max and M5 Ultra processors, although Apple has not revealed its plans for the composition. In addition, the company has not disclosed any specifications of these units, although we expect that they will be equipped with fresh general cores, renovated GPU, improved NPU and possibly improved memory subsystems.

The report claims that the fresh M5 Apple processors will exploit organic substrates with improved ABF “Ajinomoto” movies, which can augment the density of mutual connections, and also reduce the thickness of SOC packages. In addition, the M5 Pro, Max and Ultra versions will exploit hybrid bonding and 2.5D-SOIC-MH TSMC packaging (horizontal formation)-to disconnect the CPU and GPU (downloading page from Intel’s book) and reduce thermal density, in accordance with Ming-chi kuoA reputable analyst at TF International Securities. The transition to designs of many chiplet with high -performance processors makes sense to Apple, because it will allow the brand to augment the yields at the expense of a longer production cycle.

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This year’s SOC is expected to exploit the N3P TSMC production technology, reinforced optical efficiency of the N3E production process. As an optical shrinking, the N3P node allows programmers to either augment efficiency by 4% at the same power level, or reduce power consumption by 9% at identical clock speeds. In addition, it increases the density of the transistor by 4% for mixed designs, defined by TSMC as 50% logic, 30% SRAM and 20% analog circuits.

Considering microarchitectonic improvements, improvements in process technology and a multi -detailed Premium M5 SOC project, it is logical to assume that they will offer significant advantages of performance compared to M4 processors (although the actual numbers remain to see).

TSMC has repeatedly said that his N3P would enter mass production in the second half of 2024, so it would make sense, time for the company to start mass production systems in this production node at the end of last year. It is likely that the M5 Apple will be one of the first processors who used N3P (although it is speculation), so the chance that TSMC is currently mass -producing SoC is quite high. As for the higher variants of M5 Pro, M5 Max and M5, which probably rely on the design of many collapses and exploit advanced packaging, we expect their mass production to start a little later.

This does not mean that the first Apple products from M5 are just around the corner – Apple has completed the update of its product offer with M4 series processors in October, so it probably is not in a hurry with successors yet. We expect us to see M5 products later this year.

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